ret y rt - thin single in-line low profile package ideal for compact required circuit - glass passivated junction - high surge current capability - ul recognized file # e-326243 base p/n with suffix "g" on packing code - halogen-free sy m bol u n i t v rrm v v rms v v dc v i f(av) a i 2 ta 2 s r jc o c/w t j o c t stg o c document number: ds_d1402001 version: c14 storage temperature range - 55 to +150 operating junction temperature range - 55 to +150 maximum reverse current @ rated vr t j =25 t j =100 i r note 1: pulse test with pw=300 s, 1% duty cycle note 2: mount on heatsink size of 4" x 6" x 0.25" al-plate t s1 0 k l6 0 t s1 0 k l8 0 t s1 0 k l1 0 0 600 800 1000 typical thermal resistance (note 2) 1.5 a v rating of fusing ( t<8.3ms) 134 maximum instantaneous forward voltage (note 1) i f = 5 a v f 1.0 5 150 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 180 a maximum rms voltage maximum dc blocking voltage maximum average forward rectified current 10 420 560 700 600 mounting torque: 0.56 nm max. (5 in-lbs. max.) weight: 2.5g (approximately) m ax i m u m rat i n gs an d elect ri cal ch aract eri st i cs (t a =25 unless otherwise noted) param et er maximum repetitive peak reverse voltage 800 1000 m ech an i cal dat a kbjl case: kbjl molding compound, ul flammability classification rating 94v-0 terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test polarity: as marked ts10kl60 thru TS10KL100 taiwan semiconductor glass passivated sin g le-phase brid g e rectifiers feat u res - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec downloaded from: http:///
part n o. note 1: "xx" defines voltage from 600v (ts10kl60) to 1000v (TS10KL100) part n o. ts10kl80 ts10kl80 (ta=25 unless otherwise noted) document number: ds_d1402001 version: c14 d3 g green compound ts10kl80 d3g green com pou n d code pack age pack i n g suffix "g" kbjl 20 / tube rat i n gs an d ch aract eri st i cs cu rv es ts10klxx (note 1) ts10kl80 d3 d3 ex am ple green com pou n d code descri pt i on d3 ts10kl60 thru TS10KL100 taiwan semiconductor pack i n g code preferred p/n pack i n g code orderi n g i n form at i on 0 2 4 6 8 10 12 0 25 50 75 100 125 150 average forward a current (a) case temperature ( o c) fig.1 forward current derating curve resistive or inductiveload with heatsink 0 50 100 150 200 11 01 0 0 peak forward surge current (a) number of cycles at 60 hz fig. 2- maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 instantaneous forward current (a) forward voltage (v) fig. 3- typical forward characteristics pulse width-300 s 1% duty cycle tj=25 tj=125 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 4- typical reverse characteristics tj=25 tj=125 downloaded from: http:///
min max min max a 24.70 25.30 0.972 0.996 b 10.00 10.60 0.394 0.417 c 1.20 1.60 0.047 0.063 d 0.90 1.10 0.035 0.043 e 2.10 2.30 0.083 0.091 f 7.30 7.70 0.287 0.303 g 5.50 5.90 0.217 0.232 h 14.40 15.40 0.567 0.606 i 24.90 25.50 0.980 1.004 j 4.00 4.40 0.157 0.173 k 3.00 3.40 0.118 0.134 m 6.90 7.30 0.272 0.287 n 2.50 2.90 0.098 0.114 o 0.30 0.70 0.012 0.028 p/n = specific device code yww = date code f = factory code document number: ds_d1402001 version: c14 unit (inch) m ark i n g di agram ts10kl60 thru TS10KL100 taiwan semiconductor pack age ou t li n e di m en si on s dim. unit (mm) 0 40 80 120 160 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5- typical junction capacitance f=1.0mhz vsig=50mvp-p f f f + ~ ~ d o a b j k h e g i m n c downloaded from: http:///
ret y rt assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1402001 version: c14 ts10kl60 thru TS10KL100 taiwan semiconductor n ot ic e specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf, downloaded from: http:///
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